SOCAMM2 replaces soldered LPDDR memory with detachable, upgradable modules that combine LPDDR efficiency with server-class ...

SK hynix Inc. (or "the company", announced today that it has begun mass production of the 192GB SOCAMM2, a next-generation memory module standard based on the 1cnm process (sixth-generation of the 10 ...

A new AI module runs generative models locally, reducing power use and cloud reliance while handling complex workloads with ...

Within AI racks and supernodes, short-reach, high-density interconnect remains one of the most critical parts of the architecture. Copper-based solutions continue to play an important role in scale-up ...

Rambus has launched a SOCAMM2 chipset designed to support power‑efficient, high‑performance LPDDR5X memory modules in AI ...

SK hynix Inc. said Monday it has begun mass production of a next-generation memory module designed for artificial ...

Texas Instruments Inc. (TI) announced several power management devices and a reference design to help companies meet AI computing demands and scale power management architectures from 12 V to 48 V to ...

Infineon Technologies released a reference design using the company’s TDM22545D dual-phase OptiMOS power module to address AI server demands. The 10- × 9- × 5-mm power module co-packages two smart ...

SK Hynix is launching mass production of its new SOCAMM2 memory modules, specifically for Nvidia's Vera Rubin chips, aiming ...

DALLAS--(BUSINESS WIRE)--To meet the growing power demands of applications including artificial intelligence (AI), large language models (LLMs), and machine learning (ML), OmniOn Power TM has ...

The 2.3 x 1.45 x 0.58-in. IPM300 300-W dual-input power module for AdvancedTCA (ATCA) boards is a rugged quarter-brick with dual-redundant, hot-swap –48-V inputs with EMI filtering. The module ...